规格：

高纯银：99.999%Ag-5N-F-29

     检测杂质：Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn

     杂质总含量：≤10ppm

     高纯银：99.9999%Ag-6N-F-30

     检测杂质：Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn

     杂质总含量：≤1ppm

用途：主要用于制备高纯半导体合金、电子管、晶体管焊接材料、精密仪表接点材料及原子反应堆控制棒等。

包装：聚乙烯塑料瓶包装外套双层复合膜真空封装或玻璃管真空封装。

Specification:

  High purity Ag: 99.999%Ag-5N-F-29

  Testing impurity: Al, Au, Bi, Cd, Cu, Fe, Mg, Ni, Pb, Sb, Sn, Zn

Total impurity content:≤10ppm

  High purity Ag: 99.9999%Ag-6N-F-30

  Testing impurity: Au, Bi, Cu, Fe, Mg, Ni, Pb, Sn, Zn

Total impurity content:≤1ppm

Application: Used for the preparation of high purity semiconductor alloy, electron tubes, transistor welding material, precision meter contact material, and control rod of atomic reactor etc.

Package: Packed with polythene plastic bottle, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.

注：产品实际价格以询价为准！