规格：

     高纯锡：99.999%Sn-5N-I-15

     检测杂质：Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn

     杂质总含量：≤10ppm

     高纯锡：99.9999%Sn-6N-I-16

     检测杂质：Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn

     杂质总含量：≤1ppm         

     高纯锡：99.99999%Sn-7N-I-17

     检测杂质：Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn

    杂质总含量：≤0.1ppm

用途：主要用于制备化合物半导体、高纯合金、超导材料、焊料以及化合物半导体的掺杂剂。

包装：涤纶薄膜包装后双层复合膜真空封装或直接玻璃管真空封装。

Specification:

  High purity Sn: 99.999%Sn-5N-I-15

  Testing impurity: Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn

Total impurity content:≤10ppm

  High purity Sn: 99.9999%Sn-6N-I-16

  Testing impurity: Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn

Total impurity content:≤1ppm

High purity Sn: 99.99999%Sn-7N-I-17

Testing impurity: Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn  

Total impurity content:≤0.1ppm

Application: Tin is used in the manufacture of compound semiconductor, high purity alloy, superconducting material, solder and as a dopant of compound semiconductor.

Package: Packed with terylene film, and double poly-film with vacuum encapsulation. Packed with glass tube with vacuum encapsulation directly.

注：产品实际价格以询价为准！