ESL 42013-A 是分散在有机基体里的PSZ粉末形成的弹性挤塑薄膜。在1450℃-1550℃的温度范围内烧结，形成致密白色的陶瓷带。该产品用在硅覆盖的聚酯薄膜上，防止其受到机械损伤，且有利于操作处理。该生瓷带通常与铂浆（ESL5570系列）共烧，应用于平板式传感器。

产品特性 TYPICAL PROPERTIES

生瓷带厚度TAPE THICKNESS: (custom thicknesses available)                          125 μm±10%

操作工艺 PROCESSING

标准烧结温度峰值TYPICAL PEAK SINTERING TEMPERATURE FOR PARTS:            （1500°C,3 h）

稳定剂STABILIZING AGENT: Y2O3                                                      氧化钇

稳定剂含量STABILIZER CONTENT:                                                   5.0mol %

烧结收缩率FIRED SHRINKAGE:                                               X: 17.3 ± 1.0 %

(12-layer bar fired at 1500°C for 3 hours)                                              Y: 18.3 ± 1.0 %

烧结密度FIRED DENSITY:(1500°C for 3 hours)     theoretical                              ≥ 97% 理论上