lead-free thick film chip resistors
6.
characteristics:
characteristic limits
test method
(jis-c-5201)
±
0.5%
±
1%
1
Ω
--- 10
Ω
≤
±
400ppm/
°
c
11---100
Ω
≤
±
200ppm/
°
c
101
Ω
---1m
Ω
≤
±
100ppm/
°
c
temperature
coefficient
±
2%
±
5%
1
Ω
--- 10
Ω
≤
±
400ppm/
°
c
11
Ω
--- 10m
Ω
≤
±
200ppm/
°
c
4.8 natural resistance
change per temp
. degree
centigrade
r
2
-r
1
×
10
6
(ppm/
℃
)
r
1
(t
2
-t
1
)
r
1
: resistance value at room
temp
. (t
1
)
r
2
: resistance value at room
temp
. +100
℃
(t
2
)
test pattern: room temp
.,
room temp
. +100
℃
±
0.5%
±
1%
±
(1%+0.1
Ω
) max.
short-time
overload
±
2%
±
5%
±
(2%+0.1
Ω
) max
4.13 permanent resistance
change after the application
of 2.5 times rcwv for 5
seconds.
insulation
resistance
1,000 m
Ω
or
more
4.6 apply 500v dc between
protective coating and
termination for 1 minute,
then measure.
dielectric
withstanding
voltage
no evidence of flashover
mechanical damage, arcing
or insulation break down.
4.7 resistors shall be
clamped in the trough of a 90
℃
metallic v-block and shall
be tested at ac potential
respectively specified in the
given list of each product
type for 60-70 seconds.
terminal bending
±
(1%+0.05
Ω
) max
4.33 twist of test board:
y/x = 3/90 for 60
seconds
soldering
heat
resistance change rate is:
±
(1%+0.05
Ω
) max
4.18 dip the resistor into a
solder bath having a
temperatuer of260
°
c
±
3
°
c and
hold it for 10
±
1 seconds.